scia Systems GmbH
Booth number: 4205-07
www.scia-systems.com/
About us
scia Systems develops and manufactures equipment with complex plasma and ion beam technologies for ultra-precise surface processing. The systems are used for coating, etching, and cleaning processes with nanometer resolution and have been successfully implemented in various high-tech industries worldwide, including microelectronics, MEMS, and precision optics industries. Due to their flexible and modular design, the process equipment can be configured according to customer-specific requirements for research applications as well as high-volume production in either a "cluster" or "inline" configuration.
Address
Clemens-Winkler-Str. 6c
09116 Chemnitz
Germany
E-mail: info@scia-systems.com
Phone: +49 371 33561-0
Internet: www.scia-systems.com/
3104 234th Ct SE
98075 Sammamish, WA
United States
E-mail: a.biegaj@scia-systems.com
Phone: +1 425 7850682
Internet: www.aardtechnology.com/
Contact person:
Philipp Böttger
Technical Sales Manager
E-mail: sales@scia-systems.com
Phone: +49 371 33561-561
Products & Services
scia Systems provides precise surface processing equipment based on advanced ion beam and plasma technologies. The systems are applicable for coating, etching, and cleaning processes, especially for the MEMS, microelectronics, and precision optics industries. The process equipment is flexible and modular in design, thus can be easily configured for research applications and for high-volume production. It suits silicon wafer-based substrate sizes, smaller samples on carriers, and optical substrates with up to 3 m diameter.
Trimming of Waveguide Dimensions with scia Trim 200
The scia Trim 200 is used for high-precision surface trimming of wafers without limitations on film and wafer materials, such as Si3N4, Si, LiNbO3, and LiTaO3. With a non-uniformity of < 0.5 %, the system allows precise dimensional correction, for example, on waveguides.
Designed for high-volume production, the scia Trim 200 has a throughput and maintenance-optimized layout. It includes a semiconductor cassette handling robot that accommodates all standard wafer sizes. In addition, a cluster configuration with two process chambers and two cassette load locks is available.
Patterning of Waveguide structures with scia Mill 200
The scia Mill 200 is used for structuring complex multilayers of various materials. With its fully reactive gas compatibility, the system enables reactive etching processes with enhanced selectivity and rate. For patterning waveguides, a two-step process is applied that includes vertical etching of LiNbO3 and subsequent removal of redeposition. Thus, smooth vertical sidewalls with > 80° can be achieved.
The scia Mill 200's flexible system design allows it to be adapted as a single substrate version or in a high-volume production cluster layout with up to three process chambers and two cassette load locks.
