Micromachining requirements vary widely, from cutting and drilling to engraving, structuring, and laser lift-off. microPRO™ brings these applications onto one adaptable platform. Configuration packages combine technology modules such as high-speed cutting, drilling, engraving, structuring and modification, cylindrical machining, and laser lift-off, so the system is tailored to your process.

The platform processes metals, alloys, transparent and biological substrates, ceramics, and thin-film compound systems. You can choose one laser source from ns, fiber, fs, ps, or CO2 options, and different optical setups and quick-change clamping units adapt the system to each application.

The industrial microPRO offers ±0.003 mm positioning accuracy and substrates up to 400 × 400 mm. For compact applications, microPRO XS provides a freely configurable working area on substrates up to 200 × 200 mm, with ±0.015 mm positioning accuracy in a smaller footprint. Both systems support automatic handling, and loading and unloading can be designed to your production requirements.

Designed for research, development, and industrial production, the microPRO family scales from prototypes to production lines.

Visit us at Photonics West 2027 on the German Pavilion to discuss your micromachining requirements.