Large, flat substrates often require several tools and process steps. 3D-Micromac's microSHAPE™ brings them together on one highly versatile laser platform. Its gantry design scales in size and accuracy to match your process, from GEN 4 (680 × 880 mm) up to GEN 8.5 (2,200 × 2,500 mm) substrates, with thicknesses from 0.03 to 10 mm.

microSHAPE handles glass cutting, including display, cover, and ultra-thin glass, as well as thin-film ablation, volume ablation, and surface marking. It processes glass, metals, polymers, ceramics, display stacks, and coated substrates. Up to three laser sources and three beam paths let you combine processes in a single machine, and parallel working heads raise throughput.

From manual loading to robotic handling and full line integration, the system adapts to your production environment. Its modular design makes it a practical choice from first trials to series production.

Visit us at Photonics West 2027 on the German Pavilion to discuss your large-substrate laser processing requirements.