Selective laser annealing defines sensor sensitivity directly at wafer level. 3D-Micromac’s microVEGA® xMR combines a selective laser spot with a local, in-situ rotatable magnetic field. The laser heats defined sensor areas, and the magnetic field pins their reference layer in the desired direction. The heat-affected zone extends only a few micrometers beyond the sensor, so individual sensors can be placed closer to one another and to logic elements. This enables compact, monolithically integrated layouts, from Wheatstone bridges to angle and multi-axis concepts.

The microVEGA xMR supports both GMR and TMR sensors, with in- and out-of-plane programming. Laser pulse energy, magnetic orientation, and sensor dimensions are flexibly controlled by recipe, and very high energy homogeneity supports consistent sensor quality. Wafers up to 300 mm are supported, with an optional bridge-tool capability.

Proven in 24/7 high-volume fabs worldwide, the system turns complex sensor programming into a single, adjustable production step. Whether you are developing next-generation sensor architectures or scaling to series production, microVEGA xMR is built for cost-efficient, high-yield manufacturing.

Visit us at Photonics West 2027 on the German Pavilion to discuss your requirements for next-generation TMR/GMR sensor architectures.