SPIE.Photonics West 2027Products & Services microPRO XS OCF: Laser Annealing for SiC Power Devices
microPRO XS OCF: Laser Annealing for SiC Power Devices
Exhibitor
3D-Micromac AG
Selective laser annealing enables targeted activation of functional layers with minimal thermal impact on surrounding structures – a key technology in advanced semiconductor production. Our systems offer outstanding process uniformity, repeatability, and efficiency at an industrial scale.
The microPRO XS OCF enables accurate activation of ohmic contacts on SiC wafers for power device applications. It delivers application-optimized annealing at the highest technological level while keeping CoO low.
The microPRO XS OCF system provides laser annealing with high repeatability and throughput in a versatile system.