Customized laser diode packaging for efficient thermal management and reliable high-power operation.

PHOTONICPARTS develops and manufactures customized packages for high-power continuous-wave laser diodes. Our solutions combine precision soldering, optimized thermal interfaces, wire bonding and application-specific mechanical design to ensure efficient heat dissipation, low electrical resistance and long-term reliability.

For particularly demanding applications, our innovative packaging concepts incorporate diamond heat spreaders, combining exceptionally high thermal conductivity with electrical insulation. This enables compact, electrically isolated diode assemblies with optimized cooling performance, making them particularly suitable for high-power laser systems and stacked diode configurations.

Key features:

• Customized packaging for high-power CW laser diodes

• Integrated diamond heat spreaders for efficient thermal management and electrical insulation

• Precision soldering and reliable electrical interconnections

• Wire bonding and application-specific package design

• Compact and stackable diode package configurations

• In-house development, manufacturing and assembly

• Solutions for industrial lasers, solid-state laser pumping and fusion research