Fully soldered laser high power crystal package for slab geometries.

Excellent performance for amplification of ultrashortpulse laser beams.

Depending on the setup and applied power, thermal bonding of solid-state laser crystals plays a key role in achieving stable and high-performance amplification power. Our design concept and solder joining technology enables us to achieve a homogeneous heat dissipation over large bonding surface areas. After years of dedicated research and development for high-end laser beam sources supported by thermal simulations, we have innovated a distinctive approach for mounting and cooling solid-state laser crystals.

• Stress-reduced crystal mounting due to CTE-matched heatsink material pairing

• Flux-free soldered crystal package

• Homogenous heat dissipation over entire crystal surface area

• Design and manufacturing of packaging solutions for laser gain media

• Industry proven concept

• Excellent performance for demanding industry and laboratory application

• Easy adaptable to different crystal dimensions and dopant concentration

• Integrated water-cooling with optimized in-flow through microchannels

Fully soldered laser high power crystal package for rod geometries.

Excellent performance for amplification of laser beams.

Depending on the setup and applied power, thermal bonding of solid-state laser crystals plays a key role in achieving stable and high-performance amplification power. Our design concept and solder joining technology enables us to achieve a homogeneous heat dissipation over large bonding surface areas. After years of dedicated research and development for high-end laser beam sources supported by thermal simulations, we have innovated a distinctive approach for mounting and cooling solid-state laser crystals.

• Stress-reduced crystal mounting due to CTE-matched heatsink material pairing (submount technology)

• Flux-free soldered crystal package

• Homogenous heat dissipation over entire crystal surface area

• Design and manufacturing of packaging solutions for laser gain media

• Industry proven concept

• Excellent performance for demanding industry and laboratory application

• Easy adaptable to different crystal dimensions and dopant concentration

• Integrated water-cooling with optimized in-flow through microchannels

Non-linear crystral packaging – frequency conversion units

Our non-linear conversion chambers are fully outgassing-free, making them ideal for UV applications with minimized aging. The non-linear crystals are soldered onto CTE-matched submounts, ensuring mechanical stability and thermal reliability. Hermetically sealed or purgeable designs, combined with a precision, provide maximum protection against contamination and optimal thermal performance.

• CTE-matched heatsink material pairing for NL-crystals

• Including high precision resistance heater

• Sealed box to prevent contamination and to extend lifetime

• Fully vacuum compatible

• purging option available

Optimized for multi-100W to kW laser systems

Our Faraday rotators and isolators are designed for laser systems operating in the multi-100 W to kW power range at 1030 nm and 1064 nm. A key feature is the direct soldered connection of the crystal barrel surface (KTF or TGG) to a water-cooled heatsink, realized using a flux-free soldering process. This enables highly efficient thermal management and minimal thermal shift, even at highest optical loads. Thanks to our proprietary magnetic field design and the use of soldering technology, we offer stable, high-performance solutions for applications where standard components are no longer sufficient.

• Soldered KTF crystals with integrated water cooling

• Slab and rod crystal geometries

• Power rating: Multi - 100W to kW

• max Aperture: Rod (dia 15mm / slab 15x25 mm²)

• Crystal material: TGG/KTF

• Wavelength: 1030 nm / 1064 nm

• Transmission: > 95% Extinction ratio: > 30 dB

• Damage threshold: 10J/cm² at 10 ns, 1J/cm² at 8 ps

Robust optomechanics and optics on submounts

By utilizing flux-free soldering and CTE-matched submounts, our optomechanical assemblies enable low-stress mounting of optical components, ensuring long-term stability and high optical quality. This approach is particularly suited for deformation-sensitive elements, such as thin optical plates where wavefront planarity must be preserved. Additionally, the soldered, adhesive-free interfaces offer minimal outgassing, making them ideal for UV applications and contamination-sensitive environments. Our modular design allows for straightforward adaptation to different optic sizes and geometries.

Metallization service for optics, ceramics, metals

• Application of solderable metallizations

• partial metallization of optics

• PVD application of different solder materials

High precision flexure mirror mounts with soldered CTE-matched optic interface

Our SFM mirror mounts feature monolithic bodies with optics soldered via CTE-matched submounts for maximum mechanical and thermal stability. The flux-free soldering process ensures stress-free, long-term reliable bonding without adhesives. This design enables robust, vibration-resistant alignment – ideal for high-stability beam delivery in demanding environments.

• Excellent pointing stability over changing conditions (Very low angle change (<20μrad in both axis) after multiple ΔT=60K temperature cycles

• Optical component soldered on CTE-matched submount to reduce thermomechanical stress

• Ultra compact design; minimal footprint

• Vacuum compatible

• Easily adaptable to different mirror dimensions

Optical components for machine-assisted assembly

Our active alignment technology enables us to achieve repeatable, consistent positioning of optical components in a molten solder interface. Local remelting using integrated heaters allows us to fix optical elements permanently and, stress-free fixation – without raditional mounts. The result: compact, robust, and precisely aligned optical systems.

• Repeatedly adjustable in liquid solder

• Fully integratable in machine-assisted automation setups

• Completely glue-free, UV/vacuum/spacecompatibility

• Integrated heater and temperature sensor

Customized laser diode packaging for efficient thermal management and reliable high-power operation.

PHOTONICPARTS develops and manufactures customized packages for high-power continuous-wave laser diodes. Our solutions combine precision soldering, optimized thermal interfaces, wire bonding and application-specific mechanical design to ensure efficient heat dissipation, low electrical resistance and long-term reliability.

For particularly demanding applications, our innovative packaging concepts incorporate diamond heat spreaders, combining exceptionally high thermal conductivity with electrical insulation. This enables compact, electrically isolated diode assemblies with optimized cooling performance, making them particularly suitable for high-power laser systems and stacked diode configurations.

Key features:

• Customized packaging for high-power CW laser diodes

• Integrated diamond heat spreaders for efficient thermal management and electrical insulation

• Precision soldering and reliable electrical interconnections

• Wire bonding and application-specific package design

• Compact and stackable diode package configurations

• In-house development, manufacturing and assembly

• Solutions for industrial lasers, solid-state laser pumping and fusion research

High-Precision Flexure Mirror Mounts

Ultra-stable mirror mounts for demanding laser and optical applications

PHOTONICPARTS offers high-precision flexure mirror mounts designed for exceptional pointing stability, mechanical robustness, and long-term reliability. Our mounts combine precision-engineered flexure mechanisms with adhesive-free optical mounting technologies, making them particularly suitable for demanding applications in laser technology, aerospace, defense, and quantum systems.

The use of solder-based joining techniques ensures stable and reliable optical fixation without the limitations associated with conventional adhesive bonding. The compact and robust design enables precise optical alignment while minimizing the influence of mechanical stress and environmental conditions.

Key features:

• High pointing stability and precise optical alignment

• Adhesive-free optical mounting using advanced soldering technologies

• Mechanically robust and long-term stable design

• Suitable for vacuum environments

• Compact flexure-based mechanical design

• Customized configurations for specific optical requirements

• Ideal for high-performance laser and precision optical systems

Customized Photonic Packaging Solutions

Application-specific packaging and assembly solutions for advanced photonic components

PHOTONICPARTS develops and manufactures customized packaging solutions for laser crystals, non-linear crystals, optical components, and other demanding photonic assemblies. Our approach combines advanced joining technologies, precision alignment, and optimized thermal management to meet the specific requirements of each application.

Our core expertise lies in producing homogeneous, large-area solder joints between a wide variety of materials, enabling mechanically robust connections with low thermal and electrical resistance. Using flux-free soldering processes, we provide adhesive-free assemblies designed for excellent thermal stability, reliability, and vacuum compatibility.

From initial package design and material selection to prototyping and manufacturing, PHOTONICPARTS supports customers throughout the entire development process. Our flexible approach allows customers to integrate their own optical components into application-specific packages optimized for their individual requirements.

Key features:

• Customized packaging for laser crystals, non-linear crystals, and optical components

• Homogeneous, large-area solder joints for efficient thermal management

• Flux-free and adhesive-free assembly technologies

• High mechanical stability and low thermal resistance

• Precision alignment and integration of optical components

• Application-specific material selection and package design

• Development, prototyping, and manufacturing from a single source

• Suitable for demanding industrial, aerospace, defense, and quantum applications