Wafer Dicing – Precise Scribe & Break with the DTX 200 NX
Precise wafer singulation is a critical step in the production of modern microtechnology. Whether in optics, sensor manufacturing, or general wafer processing: clean, low-stress break edges and maximum repeatability are essential.
With the DTX 200 NX, we offer a mechanical "scribe & break" system specifically designed for brittle materials – precise, reliable, and highly flexible.