Fully soldered laser high power crystal package for rod geometries.

Excellent performance for amplification of laser beams.

Depending on the setup and applied power, thermal bonding of solid-state laser crystals plays a key role in achieving stable and high-performance amplification power. Our design concept and solder joining technology enables us to achieve a homogeneous heat dissipation over large bonding surface areas. After years of dedicated research and development for high-end laser beam sources supported by thermal simulations, we have innovated a distinctive approach for mounting and cooling solid-state laser crystals.

• Stress-reduced crystal mounting due to CTE-matched heatsink material pairing (submount technology)

• Flux-free soldered crystal package

• Homogenous heat dissipation over entire crystal surface area

• Design and manufacturing of packaging solutions for laser gain media

• Industry proven concept

• Excellent performance for demanding industry and laboratory application

• Easy adaptable to different crystal dimensions and dopant concentration

• Integrated water-cooling with optimized in-flow through microchannels