Designed for optimal speed in dicing narrow streets on III-V substrates (like InP or GaAs) and hard materials, dry-process dicing is the optimal solution for high-yield manufacturing. With a fast, user-friendly interface and fully automated processing, the process reduces downtime and human intervention. The precision diamond scribe tool processes 3-5 microns of a 20-micron street, allowing more die-per-wafer, which is efficient and economical. The breaking method enables a precise means of die separation with minimal debris, ensuring better quality cuts and a higher overall device yield.

CLT nanoPerforation & Dynatex DTX-200 by CLT Scribe & Break

The combination of Corning Laser Technologies’ nanoPerforation process (e.g., with a CLT 400SWD) paired with mechanical breaking by a Dynatex DTX-200 expands the processing capabilities for applications involving glass.