Corning Laser Technologies GmbH
Booth number: 4205-48
www.corning.com/lasertechnologies
About us
Corning Laser Technologies (CLT) combines more than 25-years’ experience in designing laser-based machine tools with more than 150 years of Corning Incorporated’s deep understanding of material science. CLT offers laser glass processing systems with the ability to cut Corning® Gorilla® Glass, Lotus™ NXT, and Eagle XG® glass, as well as other chemically strengthened and non-strengthened glass types including soda-lime and other brittle materials. These machine platforms serve a wide range of emerging applications that require precise and flexible glass processing technologies. They are constructed for 24/7 operation in an industrial environment. Respectively designed for substrate sizes from less than 10mm x 10mm up to 2.5m edge length and combining superior beam delivery technology from fixed optics via scanner systems to freeform and 3D cutting, CLT enables flexible adaption to individual customer design requirements. CLT also offers in-house process development and tailored solutions for full automation – leveraging knowledge and experience for a one-stop-shop for laser processing requirements.
Address
Robert-Stirling-Ring 2
82152 Krailling
Germany
E-mail: cltinfo@coring.com
Phone: +49 89 899 48280
Internet: www.corning.com/lasertechnologies
Contact person:
Hassan Ali
E-mail: CLTVerkauf@corning.com
CLT 500X
The CLT 500X is a laser processing workstation designed for high-precision applications in the glass, precision engineering, and electronics industries especially for augmented reality. The machine’s axes are driven by linear motors. This technology enables high processing speeds while maintaining very good dynamic stability in the axes. The accuracy and precision of the system is due to the high-resolution glass scales used in each axis as measuring components in the motion control system. The CLT 500X is built around a solid granite platform, allowing a high degree of overall accuracy for the machine.
CLT 400S
The CLT 400S-WD has been developed to provide a new laser dicing solution for the Semiconductor industry with a compact footprint and high precision stages. By uniting the innovative laser process with the StreetSmart breaking technology, we offer an industry-leading Glass-Wafer Dicing Solution to yield superior throughput, enable unprecedented aspect ratios and a die quality that meets highest demands.
DTX-200 by CLT
Designed for optimal speed in dicing narrow streets on III-V substrates (like InP or GaAs) and hard materials, dry-process dicing is the optimal solution for high-yield manufacturing. With a fast, user-friendly interface and fully automated processing, the process reduces downtime and human intervention. The precision diamond scribe tool processes 3-5 microns of a 20-micron street, allowing more die-per-wafer, which is efficient and economical. The breaking method enables a precise means of die separation with minimal debris, ensuring better quality cuts and a higher overall device yield.
CLT nanoPerforation & Dynatex DTX-200 by CLT Scribe & Break
The combination of Corning Laser Technologies’ nanoPerforation process (e.g., with a CLT 400SWD) paired with mechanical breaking by a Dynatex DTX-200 expands the processing capabilities for applications involving glass.
CLT JobShop - Access Lab & Contract Manufacturing
Would you like to test the potential of glass laser processing without having to overcome major entry hurdles?
-> Discover the advantages and possibilities of lasers on your own individual product!
Are you looking to bridge your limited machine availability?
Do you want to be able to outsource your production to an experienced and reliable partner in the event of recurring resource bottlenecks?
Do you want certain parts, right up to volume production, permanently from an established external production source?
-> Our JobShop offers you the opportunity to benefit from our glass expertise combined with our experience in laser processing. This makes Corning Laser Technologies your partner of choice: complete cutting and logistics service, from the optional provision of substrates, packaging, quality control of the end product through to shipping.
