The scia Mill 200 is used for structuring complex multilayers of various materials. With its fully reactive gas compatibility, the system enables reactive etching processes with enhanced selectivity and rate. For patterning waveguides, a two-step process is applied that includes vertical etching of LiNbO3 and subsequent removal of redeposition. Thus, smooth vertical sidewalls with > 80° can be achieved.

The scia Mill 200's flexible system design allows it to be adapted as a single substrate version or in a high-volume production cluster layout with up to three process chambers and two cassette load locks.