The scia Trim 200 is used for high-precision surface trimming of wafers without limitations on film and wafer materials, such as Si3N4, Si, LiNbO3, and LiTaO3. With a non-uniformity of < 0.5 %, the system allows precise dimensional correction, for example, on waveguides.

Designed for high-volume production, the scia Trim 200 has a throughput and maintenance-optimized layout. It includes a semiconductor cassette handling robot that accommodates all standard wafer sizes. In addition, a cluster configuration with two process chambers and two cassette load locks is available.