SPIE.Photonics West 2024Products & Services Hybrid PICs

Hybrid PICs

Exhibitor
Fraunhofer Institute for Telecommunications, Heinrich-Hertz-Institut HHI

Fraunhofer HHI’s PolyBoard platform enables the hybrid integration of complex and highly functional photonic integrated circuits (PICs) comprising active and passive optical functionalities. Furthermore, PolyBoard’s micro-optical bench offers structures such as U grooves, slots and vertical mirrors allowing the integration of SM fibers, GRIN lenses, NLO crystals, λ/2 and λ/4 plates, PBS/PBC, thin film filters, as well as active components like lasers, detectors and modulators.
Further reading

HHIs μBench enables the integration of micro-optical elements and functions on PICs

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