SPIE.Photonics West 2024German Exhibitors Fraunhofer Institute for Telecommunications, Heinrich-Hertz-Institut HHI
Fraunhofer Institute for Telecommunications, Heinrich-Hertz-Institut HHI
Booth number: 4205-33
www.hhi.fraunhofer.de
About us
Innovations for the digital society of the future are the focus of research and development work at the Fraunhofer Institute for Telecommunications, Heinrich Hertz Institute, HHI. In this area, Fraunhofer HHI is a world leader in the development for mobile and optical communication networks and systems as well as processing and coding of video signals.
We are hiring:
Technical assistance in backend laboratory for photonic components department
Address
Fraunhofer Institute for Telecommunications, Heinrich-Hertz-Institut HHI
Einsteinufer 37
10587 Berlin
Germany
Phone: +49 30 31002-0
Einsteinufer 37
10587 Berlin
Germany
Phone: +49 30 31002-0
Products & Services
Fraunhofer HHI researches optochips and Photonic Integrated Circuits (PICs) for 100+ Gbit/sec data transmission and detection and sensor applications. The scientists offer production and development services in all of their activities to the German and international industry. As an example, if you already have a concrete optochip design in mind, the researchers offer additional consulting and would do design and fabrication iterations. Or if you start with a target spec, they would typically begin with a feasibility study and generate a design of their own. In all cases, they are able and willing to do initial production volumes in ISO certified, qualified production. Furthermore they offer e-beam services, and design-to-spec diffractive optical elements.Thin-Film Lithium-Niobate Wafer
High-Speed Electro-Optic Modulators as well as other components (thermos-optic phase-shifters, on-chip resistors,..) on a 4” Thin-Film Lithium-Niobate Wafer comprising a silicon substrate.
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Photonic Components for THz Communications
High-data rate wireless links as well as test and measurement.
Based on its mature InP technology, Fraunhofer HHI develops photonic components and systems for terahertz communications as well as test and measurement for 6G and beyond. These components allow for seamless integration into state-of-the-art fiber-based communication systems and offer broadband access to frequencies between 100 GHz and 4.5 THz.
Visit website Based on its mature InP technology, Fraunhofer HHI develops photonic components and systems for terahertz communications as well as test and measurement for 6G and beyond. These components allow for seamless integration into state-of-the-art fiber-based communication systems and offer broadband access to frequencies between 100 GHz and 4.5 THz.
Hybrid PICs
Fraunhofer HHI’s PolyBoard platform enables the hybrid integration of complex and highly functional photonic integrated circuits (PICs) comprising active and passive optical functionalities. Furthermore, PolyBoard’s micro-optical bench offers structures such as U grooves, slots and vertical mirrors allowing the integration of SM fibers, GRIN lenses, NLO crystals, λ/2 and λ/4 plates, PBS/PBC, thin film filters, as well as active components like lasers, detectors and modulators.
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