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SPIE.Photonics West 2027Products & Services Multi-Chip SMD

Multi-Chip SMD

Exhibitor
EPIGAP OSA Photonics GmbH

We are highlighting our assembly capability for multichip packaging.
This includes smart and compact solutions in a 3 x 3 mm ceramic package, modules in TO housings or designs for high-power applications. The full range of chips, from UV to the SWIR range, is available for use in these designs.

APPLICATIONS
- Multispectral Imaging
- Industrial vision illumination
- Sensors

Further reading
Multi-Chip SMD LED

Multi-Chip SMD LED

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