SPIE.Photonics West 2027Products & Services Multi-Chip SMD
Multi-Chip SMD
Exhibitor
EPIGAP OSA Photonics GmbH
We are highlighting our assembly capability for multichip packaging.
This includes smart and compact solutions in a 3 x 3 mm ceramic package, modules in TO housings or designs for high-power applications. The full range of chips, from UV to the SWIR range, is available for use in these designs.
APPLICATIONS
- Multispectral Imaging
- Industrial vision illumination
- Sensors

Multi-Chip SMD LED