SPIE.Photonics West 2023German Exhibitors Fraunhofer Institute for Reliability and Microintegration IZM

Fraunhofer Institute for Reliability and Microintegration IZM

Booth number: 4105-29

About us

Fraunhofer IZM develops electronic and photonic packaging solutions. We help companies assemble robust and reliable electronic and photonic systems and integrate these into the application environment. One of our core competences is the development of innovative packaging systems comprising microelectronic, optical and microsystems components for tele- and datacom, lighting, sensors and other photonics applications. Demonstrators are realized using simulation, customer specific design, reliability and failure analyses.

All pictures copyright Fraunhofer IZM/Volker Mai.

Hybrid integration of a micro-electrooptical array on glass

Hermetically sealed glass package with TGVs for radar level sensor (BMBF project GlaRA)

The glassy future of circuit boards: electro-optical circuit board by Fraunhofer IZM

Address

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin
Germany

E-mail: info@izm.fraunhofer.de
Phone: +49 30 46403-100
Internet: www.izm.fraunhofer.de

Contact person:

Georg Weigelt
Public Relations
E-mail: georg.weigelt@izm.fraunhofer.de
Phone: +49 30 46403-279

Products & Services

Optical Technologies and Services at Fraunhofer IZM:

Electro-optical circuit board for fast data transfer
Assembly and interconnection of electro-optical components
Simulation, design and measurement technologies
Photonic and plasmonic systems
Qualification, failure and reliability analyses
Integration by wafer and panel level packaging

Glass interposer technology for high-frequency applications

Radar sensors were developed to be especially suitable for smart industry applications due to their excellent distance resolution, accuracy, beam focusing capabilities, and size. This is based on a robust glass interposer technology for broadband mmwave modules (frequencies > 100 GHz), used to characterize SiP designs. Fraunhofer IZM has developed an industry-ready process for glass via metallization with high aspect ratios. A wafer bonding process hermetically packages the assembled components.

Hermetically sealed glass package with TGVs for radar level sensor (BMBF project GlaRA)

Hybrid integrated glass benches for photonics

Optical systems can be built with electro-optical components and electronic controls using laser-structured glass benches. Custom-shaped thin glass is also used to enable their industrial automated assembly on six axes, with less than one-micrometer accuracy. This allows high-quality optical beams to be shaped and coupled to perform optical measuring tasks. With the concept capable of working with large format panels, it can scale perfectly in terms of the size and number of systems produced.

Hybrid integration of a micro-electrooptical array for sensor applications on a glass substrate

Panel level processed glass interposers or inlays for lamination into circuit boards

Fraunhofer IZM is able to integrate single-mode waveguides in large-sized commercial glass boards using an ion-exchange technique. That technique itself is well known, but we are the only ones with a process to fabricate commercial thin glass up to sizes of 440 mm x 330 mm. This is important to enable large-size circuit boards, or indeed greater numbers of small glass plates in one go, which gets the unit costs down.