Fraunhofer Institute for Reliability and Microintegration IZM
Booth number: 4105-29
Fraunhofer IZM develops electronic and photonic packaging solutions. We help companies assemble robust and reliable electronic and photonic systems and integrate these into the application environment. One of our core competences is the development of innovative packaging systems comprising microelectronic, optical and microsystems components for tele- and datacom, lighting, sensors and other photonics applications. Demonstrators are realized using simulation, customer specific design, reliability and failure analyses.
All pictures copyright Fraunhofer IZM/Volker Mai.
Phone: +49 30 46403-279
Products & Services
Optical Technologies and Services at Fraunhofer IZM:
- Electro-optical circuit board for fast data transfer
- Assembly and interconnection of electro-optical components
- Simulation, design and measurement technologies
- Photonic and plasmonic systems
- Qualification, failure and reliability analyses
- Integration by wafer and panel level packaging