AEMtec develops, qualifies and manufactures advanced technology optoelectronic assemblies in compliance with high quality, security and sustainability standards. Our customer-specific products are complex electronic assemblies with precise component placement requirements. AEMtec offers a unique spectrum of technologies: Wafer Back-End Services (UBM, SBA, Dicing), high speed / high accuracy Dieand Flip Chip Bonding, Au and Al Wire Bonding, SMT and assembly of Optical Components.