Insufficient cooling is a limiting factor for high-performance electronics. Whether in AI data centers, high-power lasers, power electronics for electromobility or high-frequency communication, rising power densities demand cooling solutions that conventional materials can no longer deliver. Diamond offers outstanding thermal conductivity, yet it has rarely made the step from the laboratory into real cooling systems. DiamondTM is set to change that.

In this transatlantic initiative, Fraunhofer USA Center Midwest, Fraunhofer IFAM and Fraunhofer IMWS combine their expertise along the entire value chain. It reaches from diamond synthesis and microfabrication to metal-diamond composites, cooling system integration and microstructural analysis. Together we are developing two complementary approaches. Free-standing, transferable diamond nanomembranes are designed to bring the thermal performance of diamond directly to the chip and are compatible with wafer-scale processing, GaN devices and copper heatsinks. Diamond-copper composites, produced by spark plasma sintering and additive manufacturing, are tailored to match the thermal expansion of the semiconductors to be cooled. They also enable complex heatsink geometries with integrated ceramic insulation. Comprehensive thermal characterization and interface analysis help ensure that new solutions perform reliably under real operating conditions. In addition, we provide high resolution material characterization and failure analysis to support process development and secure the reliability of power electronic components.

We are looking for partners in the US and Europe who want to take their thermal management to the next level, from chip and laser manufacturers to cooling system providers and end users. Visit our booth and discuss with us how joint R&D projects, pilot studies or licensing can turn the potential of diamond into your competitive advantage.