Black Semiconductor is an integrated device manufacturer addressing a fundamental bottleneck of chip-to-chip communication with a new electronic-photonic production technology which will enable AI to scale. We will accomplish this with integrated graphene photonics technology—Black Semiconductor IGP™. FabONE, our 300mm facility designed to integrate electronics and photonics in a single production flow with graphene as the active 2D material will be the first of its kind in the industry. Founded in 2020 in Germany, we have grown to 140 people representing 30 nationalities—a team with decades of fab, engineering, and technology experience. We inspire the world to re-thinking computing. 

About our technology 

At Black Semiconductor, we are developing next generation solutions utilizing graphene to develop photodetectors and modulators and integrating them for use in chiplets and beyond. We produce wafer-scale, single-crystal graphene with atomic precision. Our graphene-based photodetectors and modulators convert optical signals into electrical ones and back again. All this at ultrafast speed, with properties that surpass conventional silicon solutions. Chiplets with Black Semiconductor IGP™ technology integrates electronics and photonics onto a single electronic-photonic integrated circuit (EPIC) independently of the CMOS node. By eliminating complex packaging and electrical interconnects, we reduce cost, improve yield, and enhance power efficiency for state-of-the-art optical interfaces. To ultimately scale compute, the industry needs a glass panel interposer which when combined with Black Semiconductor IGP™ eliminates electronic bottlenecks for limitless data throughput between chips. Black Semiconductor is the only company that enables the native integration of photonics onto the panel interposer.