SPIE.Photonics West 2025German Exhibitors Fraunhofer Heinrich Hertz Institute, HHI

Fraunhofer Heinrich Hertz Institute, HHI

Booth number: 4205-32
www.hhi.fraunhofer.de

About us


Fraunhofer HHI in Berlin, has a focus on advancing optical technology for telecommunications, sensing, and quantum communications. HHI conducts cutting-edge research and development in areas such as fiber optic networks, integrated photonics, terahertz spectroscopy, high-speed data transmission or LiDAR. The work includes the design of photonic components with high frequencies > 100 GHz in InP for advanced optical networks, including lasers, modulators and detectors as well as foundry services. In addition, hybrid photonic integrated circuits (PICs) based on PolyBoard, SiNx and TFLN single-mode waveguides in combination with active elements made of InP, GaAs or GaN are developed.


Address

Fraunhofer Heinrich Hertz Institute, HHI
Einsteinufer 37
10587 Berlin
Germany

E-mail: info@hhi.fraunhofer.de
Phone:  +49 30 31002-0
Internet: www.hhi.fraunhofer.de

Contact person:

Dr.-Ing. Dominic Schulz
Head of Strategy Photonics
E-mail: info@hhi.fraunhofer.de

Products & Services

Fiber optic components, equipment, systems
Optical components and hardware
Optical communications
Optical detectors
IR sources and detectors

Fraunhofer HHI in Berlin, has a focus on advancing optical technology for telecommunications, sensing, and quantum communications. HHI conducts cutting-edge research and development in areas such as fiber optic networks, integrated photonics, terahertz spectroscopy, high-speed data transmission or LiDAR. The work includes the design of photonic components with high frequencies > 100 GHz in InP for advanced optical networks, including lasers, modulators and detectors as well as foundry services. In addition, hybrid photonic integrated circuits (PICs) based on PolyBoard, SiNx and TFLN single-mode waveguides in combination with active elements made of InP, GaAs or GaN are developed.

High-Sensitivity Coherent LiDAR

We are excited to debut our new 2D LiDAR prototype, developed for robotics and automation applications in Industry 4.0. Through interactive live demonstrations and visual displays, we invite attendees to explore our latest advancements in high-sensitivity coherent detection and signal processing technology.

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High-Sensitivity Coherent LiDAR

Single Photon Avalanche Photodiode Module

Fraunhofer HHI provides photodetector modules for single photon detection operating from the O- to the L-band. The SPAD chips inside the modules are based on mature InP technology and are fabricated in the wafer process line of Fraunhofer HHI, with Telcordia and space-qualified processes. The SPAD supply chain is completely within EU, including packaging at the Fraunhofer HHI facility.

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High sensitivity coherent receiver module for 1550 nm

Fraunhofer HHI offers a coherent receiver module for detecting optical signals down to 1 nW in the C-band wavelength range. The application areas of the module range from LiDAR to sensing and quantum applications.

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High sensitivity coherent receiver module for 1550 nm

PICs for Quantum Technologies

The PolyBoard wafer technology with its active/passive hybrid integration and micro-optical bench enables the implementation of photonic integrated circuits for quantum technologies, e.g. QKDs transmitters for polarization encoding and photon pair sources featuring on-PIC nonlinear crystals. 

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Hybrid integration and micro-optical bench

SiN Wafer Line - Application-specific PICs from NIR down to VIS

Fraunhofer HHI offers SiN PICs that can be customized for different applications and wavelength ranges. Photonic building blocks including ring resonators, MMIs, tunable gratings and phase shifters are available. Optimized interfaces allow for the hybrid integration of lasers, gain chips and detectors. Furthermore, surface functionalization together with wafer-level micro-fluidics enables the use of the SiN wafer technology in life sciences, analytics and sensing.

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SiN Wafer Line - Application-specific PICs from NIR down to VIS

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