SPIE.Photonics West 2024German Exhibitors AIM Micro Systems GmbH

AIM Micro Systems GmbH

Booth number: 4205-18
www.aim-micro-systems.de

About us

AIM Micro Systems is an independent assembly house for all types and size >1mm to longer than 300mm edge length of image sensors and their processing: Working in a clean room 100, wafer dicing, chip/wire bonding. AIM is small, therefore flexible and fast. So, we can provide fast prototyping service between 12 working days down to 24 hours on serial equipment. We offer the complete assembly process, starting from wafer dicing 12”, chip bonding, wire bonding, final test and a complete optic measurement including supply chain management. Our range of technologies includes: Image sensor assembly for vacuum and low temperature environment (CTE match/low outgassing), Chip bonding on AlSi, Covar, Invar and other special materials, Chip attach on peltier elements, Chip stitching, FOB (fiber optical block) including scintillator attach to image sensors, hermetic Seam welding.

Assembly of image and line-scan sensors in a clean room ISO 5 or 100 Fed. Std. 209E environment

Production of all types and sizes of image sensors

Stitching of image sensors up to a sensor size more than 300x300mm².

Assembly of optical glasses down to 25µm thickness

Address

AIM Micro Systems GmbH
Im Bresselsholze 8
07819 Triptis
Germany

Phone:  +49 36482 1440-70

Products & Services

Sensor Technology
Others

AIM Micro Systems is providing an independent manufacturing service for MEMs, image and line-scan sensors in a clean room ISO 5 or 100 Fed. Std. 209E environment. We offer the complete assembly process, starting from wafer dicing (up to 12”), chip bonding, wire bonding, encapsulation, final test and a complete optic measurement including supply chain management. AIM provides a fast prototyping service between 10 working days down to 24 hours on serial equipment.

Our range of technologies includes: 

  • MEMS and Image sensor assembly for vacuum and low temperature environment (CTE match and low outgassing)
  • Chip bonding on AlSi, Covar, Invar and other special materials
  • Chip attach on peltier elements
  • Chip stitching 
  • FOB (fiber optical block) including scintillator direct attach to image sensors 
  • Seam welding N² for hermetic environment 
  • Design of image sensor packages

We offer solutions for the follow applications:

  • Space 
  • X-Ray 
  • E-beam 
  • Machine vision 
  • Low temperature / vacuum 
  • High Performance 
  • Consumer

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