Fraunhofer Institute for Reliability and Microintegration IZM

Booth number 4105-29

Fraunhofer IZM integrates optoelectronic components and efficient optical coupling in novel packages.

About us

Fraunhofer IZM develops electronic and photonic packaging solutions. We help companies assemble robust and reliable electronic and photonic systems and integrate these into the application environment. One of our core competences is the development of innovative packaging systems comprising microelectronic, optical and microsystems components for tele- and datacom, lighting, sensors and other photonics applications. Demonstrators are realized using simulation, customer specific design, reliability and failure analyses.

All pictures copyright Fraunhofer IZM/Volker Mai.

Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin

Phone: +49 30 46403-100

Contact person

Georg Weigelt
Public Relations
Phone: +49 30 46403-279

Products & Services

Optical Technologies and Services at Fraunhofer IZM: 

  • Electro-optical circuit board for fast data transfer 
  • Assembly and interconnection of electro-optical components 
  • Simulation, design and measurement technologies 
  • Photonic and plasmonic systems  
  • Qualification, failure and reliability analyses  
  • Integration by wafer and panel level packaging
Glass interposer technology for high-frequency applications

Radar sensors were developed to be especially suitable for smart industry applications due to their excellent distance resolution, accuracy, beam focusing capabilities, and size. This is based on a robust glass interposer technology for broadband mmwave modules (frequencies > 100 GHz), used to characterize SiP designs. Fraunhofer IZM has developed an industry-ready process for glass via metallization with high aspect ratios. A wafer bonding process hermetically packages the assembled components.

Hybrid integrated glass benches for photonics

Optical systems can be built with electro-optical components and electronic controls using laser-structured glass benches. Custom-shaped thin glass is also used to enable their industrial automated assembly on six axes, with less than one-micrometer accuracy. This allows high-quality optical beams to be shaped and coupled to perform optical measuring tasks. With the concept capable of working with large format panels, it can scale perfectly in terms of the size and number of systems produced.

Panel level processed glass interposers or inlays for lamination into circuit boards

Fraunhofer IZM is able to integrate single-mode waveguides in large-sized commercial glass boards using an ion-exchange technique. That technique itself is well known, but we are the only ones with a process to fabricate commercial thin glass up to sizes of 440 mm x 330 mm. This is important to enable large-size circuit boards, or indeed greater numbers of small glass plates in one go, which gets the unit costs down.

Further reading

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