AIM Micro Systems GmbH
Booth number 4105-15AIM Micro Systems makes the image sensor assembly great again: Working in a clean room ISO 5, wafer dicing, chip/wire bonding, testing. AIM provides a 24h fast prototyping service.
About us
AIM Micro Systems is providing an independent manufacturing service for MEMs, image and line-scan sensors in a clean room ISO 5 or 100 Fed. Std. 209E environment. We offer the complete assembly process, starting from wafer dicing (up to 12”), chip bonding, wire bonding, encapsulation, final test and a complete optic measurement including supply chain management. AIM provides a fast prototyping service between 10 working days down to 24 hours on serial equipment.
Our range of technologies includes:
- MEMS and Image sensor assembly for vacuum and low temperature environment (CTE match and low outgassing)
- Chip bonding on AlSi, Covar, Invar and other special materials
- Chip attach on peltier elements
- Chip stitching
- FOB (fiber optical block) including scintillator direct attach to image sensors
- Seam welding N² for hermetic environment
- Design of image sensor packages
We offer solutions for the follow applications:
- Space
- X-Ray
- E-beam
- Machine vision
- Low temperature / vacuum
- High Performance
- Consumer
Address
AIM Micro Systems GmbH
Im Bresselsholze 8
07819 Triptis
Germany
Phone: +49 36482 1440-70
Internet: www.aim-micro-systems.de
Products & Services
Image sensor assembly
AIM is working in a clean room 100 and provides a fast prototyping service down to 24 hours. We offer the complete assembly process, starting from wafer dicing 12”, chip bonding, wire bonding, final test. Our range of technologies includes: Image sensor assembly for vacuum and low temperature environment (CTE match/low outgassing), Chip bonding on special materials, chip attach on peltier elements, Chip stitching, FOB (fiber optical block) attach to image sensors, hermetic seam welding.
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