Comprehensive development and production services for next level of advanced optoelectronics.
AEMtec develops, qualifies and manufactures advanced technology optoelectronic assemblies in compliance with high quality, security and sustainability standards. Our customer-specific products are complex electronic assemblies with precise component placement requirements. AEMtec offers a unique spectrum of technologies: Wafer Back-End Services (UBM, SBA, Dicing), high speed / high accuracy Dieand Flip Chip Bonding, Au and Al Wire Bonding, SMT and assembly of Optical Components.
Address
AEMtec GmbH
James-Franck-Str. 10
12489 Berlin
Germany
Phone: +49 30 63927300
Fax: +49 30 63927302
Internet: www.aemtec.com
Contact person
Click here if you notice an image that violates copyright or privacy rights.
We only use functionally necessary cookies and the web analysis tool Matomo in order to optimally design and continuously improve our website for you. By continuing to use our website, you agree to this. Further information and an objection possibility can be found here: Data protection