Fraunhofer IZM develops electronic and photonic packaging solutions. We help companies assemble robust and reliable systems and integrate these into the application environment. Almost invisible and undervalued by many, electronic packaging is at the heart of every electronic application. Our technologies connect the individual components, protect them from vibration and moisture, reliably dissipate heat and ensure that electronic devices continue to function reliably in even the harshest conditions. They facilitate the development of ever smaller products. One of our core competences is the development of innovative packaging systems comprising microelectronic, optical and microsystems components for tele- and datacom, lighting and sensors. Demonstrators are realized using simulation, customer specific design, and reliability and failure analyses. The institute, founded in 1993, has a staff of over 300. More than 80% of our turnover is earned through contract research.
Optical Technologies and Services at Fraunhofer IZM:
Fraunhofer IZM within research project SPeeD embedded various photonic integrated circuits (PIC) fabricated in SiGe-BiCMOS technology by partner IHP. Next generation optical fiber transmitters and recceivers will require 400Gbit/s and faster data rates transmission. This version uses a spot size converter chip to couple optical fibers to chip integrated waveguides in a newly standardized package. Funding by German BMBF.
SiGe 400 Gbps Optical Chip Modulator Package: © Fraunhofer IZM | Volker Mai
Pixelated single photon avalanche detector chips for automotive LiDAR-application, mounted on structured silicon chip including through-silicon-vias and routing layers, demonstrating the versatility and precision of wafer level in packaging chip based assemblies. Fraunhofer IZM sites in Berlin and Dresden develop highest accuracy chip and RF component placing and embedding processes and geometries, scalable on wafers up to 300 mm diameter.
SPAD Chip Die Array Mounted on CMOS Chip for LiDAR: © Fraunhofer IZM | Volker Mai
Cost-efficient molded optical transceiver package in surface mount technology, developed in cooperation of Fraunhofer IZM and HHI, embedding an InP laser chip, a PolyPhotonics based modulator for 10 Gbps C-band operation. Optical transmission single mode silica fibers can simply get clicked into position, the package is producible in industrial large panel electronics fabrication machines, not shown here is an overmolding that can hermetically close the package.
Molded Optical Transceiver Package for Solder Mount: © Fraunhofer IZM
Fraunhofer Institute for Reliability and Microintegration IZM
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