The assembly & packaging department of AIM Micro Systems is providing an independent manufacturing service for image and line-scan sensors in a clean room ISO 5 or 100 Fed. Std. 209E environment. We offer the complete assembly process, starting from wafer dicing (up to 12”), chip bonding, wire bonding, encapsulation, final test and a complete optic measurement including supply chain management. AIM provides a fast prototyping service down to 24 hours on serial equipment.
Our range of technologies includes:
We offer solutions for the follow applications: