AEMtec develops, qualifies and manufactures advanced technology optoelectronic assemblies in compliance with high quality, security and sustainability standards. Our customer-specific products are complex electronic assemblies with precise component placement requirements.
AEMtec offers a unique spectrum of technologies: Wafer Back-End Services (UBM, SBA, Dicing), high speed / high accuracy Die- and Flip Chip Bonding, Au and Al Wire Bonding, SMT and assembly of Optical Components.
Head of Business Development North America
Phone: +49 30 6392-7300
E-mail: Send message