EPIGAP Optronic GmbH is an industrial leader in LED technology for state-of–the-art optoelectronics. The LED chip is the starting point for any optoelectronic solution. It essentially determines the product characteristics of the LED. EPIGAP offers high-end LED chips beginning in the deep UV range at 265 nm up to the high infrared region at 1750 nm which have a very good degradation stability and high efficiency. The requirements for LEDs are very different depending on the application. We realize products in a wide variety of housings, such as 3 mm, 5 mm, SMD or metal can as well as customized housings or specially designed CoB modules. The product line is completed by our photodiodes, available from 150 nm in the ultraviolet up to 2600 nm in the infrared range. EPIGAP offers a fully integrated service from design and development to production. EPIGAP has its own photometric and radiometric laboratory equipped with calibrated optical instruments to measure the electro-optic parameters.
EPIGAP Optronic offers a broad line of silicon photo diodes in a variety of package types ranging from metal-can to surface mount. These devices are available with standard silicon die having a spectral sensitivity of approximately 400nm - 1100nm or with special UV enhanced chips with sensitivity in the lower UV-A range. Custom active areas and multi-element chips can also be manufactured to suit your application.
In the range between 1040nm and 1650nm EPIGAP Optronic is offering the next generation of our 5mm LEDs. The new InGaAs-wafer material guaranties higher optical output power. It is 5 times stronger than the previous generation. This means that the efficiency of the LED increases at a certain spectrum and life time testing results have improved.
Chips in the wavelength range from ultraviolet, visible to near infrared (265nm up to 1720nm) can be mounted on boards (CoB). Encapsulation can be glass or optically transparent silicon or epoxy. This configuration with a high degree of flexibility can perfectly meet the current demand of customization. For high power applications the modules can be realized using copper based boards or ceramic substrates. Even in compact devices every single wavelength is separately addressable.
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