Fraunhofer IZM develops electronic and photonic packaging solutions. We help companies assemble robust and reliable systems and integrate these into the application environment. Almost invisible and undervalued by many, electronic packaging is at the heart of every electronic application. Our technologies connect the individual components, protect them from vibration and moisture, reliably dissipate heat and ensure that electronic devices continue to function reliably in even the harshest conditions. They facilitate the development of ever smaller products. One of our core competences is the development of innovative packaging systems comprising microelectronic, optical and microsystems components for tele- and datacom, lighting and sensors. Demonstrators are realized using simulation, customer specific design, and reliability and failure analyses. The institute, founded in 1993, has a staff of over 300. More than 80% of our turnover is earned through contract research.
Optical Technologies and Services at Fraunhofer IZM:
Fraunhofer Institute for Reliability and Microintegration IZM
Phone: +49 30 46403-100
Fax: +49 30 46403-111
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