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Fraunhofer Institute for Reliability and Microintegration IZM

Booth number: 4545-26

www.izm.fraunhofer.de
info@izm.fraunhofer.de

About us

Fraunhofer IZM develops electronic and photonic packaging solutions. We help companies assemble robust and reliable systems and integrate these into the application environment. Almost invisible and undervalued by many, electronic packaging is at the heart of every electronic application. Our technologies connect the individual components, protect them from vibration and moisture, reliably dissipate heat and ensure that electronic devices continue to function reliably in even the harshest conditions. They facilitate the development of ever smaller products. One of our core competences is the development of innovative packaging systems comprising microelectronic, optical and microsystems components for tele- and datacom, lighting and sensors. Demonstrators are realized using simulation, customer specific design, and reliability and failure analyses. The institute, founded in 1993, has a staff of over 300. More than 80% of our turnover is earned through contract research.



Products and services

Optical Technologies and Services at Fraunhofer IZM:

  • Electro-optical circuit board for fast data transfer
  • Assemly and interconnection of electro-optical components
  • Simulation, design and measurement technologies
  • Photonic and plasmonic systems
  • Qualification, failure and reliability analyses
  • Integration by wafer and panel level packaging
Glass-based 12ch-parallel transceiver

Glass-based 12ch-parallel transceiver

Hybridly Integrated Parallel Optics On-Board Transceiver, metallized through-glass-vias, with dispensed polymer lenses - from BMBF project HyPOT

Packaged broad-band VIS-NIR nanospectrometer

Packaged broad-band VIS-NIR nanospectrometer

Chip package with optical interconnections, spectral operation from 400nm to 1000nm from EU-project InSPECT with partners Lionix (chip manufacturing), Aifotec (fiber array assembly), and others

SiGe-modulator chip in evaluation board

SiGe-modulator chip in evaluation board

Telecom receiver realized in SiGe-BiCMOS, coupling via grating couplers for 400Gbps coherent data transmission from BMBF-project SPeeD with partners ADVA, IHP, and others

Contacts

Address
Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin
Germany

Phone: +49 30 46403-100
Fax: +49 30 46403-111

Georg Weigelt
Head of Marketing
Phone: +49 30 46403-279
georg.weigelt@izm.fraunhofer.de


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LTB Lasertechnik Berlin GmbH
Booth number: 4545-11