UniTemp GmbH was found in 2000. We develop and sell equipment for microelectronics. Our main focus is based on thermic process engineering. UniTemp combines the technical, ergonomical and economical function with perfect harmony in technics and design to achieve best quality. We are also specialized in customer specific engineering and development, whereas we try to support you in your process evaluation.
All UniTemp products are developed and manufactured in-house.
We are very flexible in adapting our standard equipment according to special requirements.
Our company is located in southern germany, closely to the Munich airport. We do have worldwide distributorship network and we are present at many foreign shows and exhibitions.
We offer equipment for R&D use in laboratories, universities and others. Our equipment is perfect for small place in labs. Our portfolio offers:
The RSS-110 and RSS-160 Reflow Solder System are excellent tools for
various solder processes up to 160 mm diameter wafer or 160 mm x 160 mm substrate size and 40 mm height.
Some examples for applications:
Laboratory furnace for all kind of developers implementing and researching new processes, prototype research, environmental research purposes and for small pre-series or series.
Semi-Automatic Wire Bonder
for Ball, Wegde & Bump
The WB-200 is a multi-purpose semiautomatic wire bond tool for R&R purpose, prototype and small series production. The WB-200 provides also a full manual Z Step control. With 3 motorized axis and optionally a powerful video/focus system / mouse controlled.
High vacuum RTP oven with ramp rate better 150K/second
This is a versatile tool for R&D labs. The oven accepts a 100mm
wafer size or 100x100mm substrate for processing up to 1200 °C.
The programming is realized by a SPS Simatic controller with touch panel. This allows an easy use and process watch.
Phone: +49 8441 787663
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